Fab Funded
HP, Winbond support fab in Taiwan
By David Lammers, EE Times
Hsinchu City, Taiwan -- A new logic foundry is getting on its feet
with support from deep-pocketed financial backers and a core group of experienced
managers drawn largely from locally based Hewlett-Packard Corp. and Winbond
Electronics Corp.
Worldwide Semiconductor Manufacturing Corp. has broken ground on construction
of a 0.35/0.25-micron fab in the Science-based Industrial Park here that
will produce its first silicon in July 1998 and be in full production by
the end of 1999, said Kuang-Yi Chiu, president. Plans call for a second line
to add another 20,000 eight-inch wafers per month of capacity about a year
later, to be in full operation by the end of the century.
Each line is expected to cost about $1.2 billion. The China Development Corp.,
the largest investment bank in Taiwan, has made Worldwide Semiconductor its
first major investment in the semiconductor field, Chiu said. "The CDC has
invested in many other high-technology projects, but not that much in
semiconductors, up to now. With WSMC as the core project, they plan to do
more in the test and packaging areas as well," he said.
The bank, Hambrecht and Quist and other financial institutions will hold
34 percent; the Yue Loong Group, Taiwan's largest auto manufacturer, and
other major corporations will put in about 27 percent of Worldwide Semi's
capital, and 13 percent will be retained by employees.
Winbond will invest cash, equivalent to a 20 percent stake, but the relationship
between Winbond and Worldwide is fairly complicated, though Chiu emphasized
that Worldwide is not a Winbond subsidiary.
(Next article.)
(c) 1997 CMP Media, Inc
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